2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023)

Welcome Message

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You are invited to present 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) will be held during April 21-23, 2023 in Xi'an, China. It's sponsored by Xi'an Shiyou University, China.


As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future.


To adapt to this changing world and China’s fast development in this new era, the 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) takes “Intelligent Computing and Signal Processing” as the theme and focuses on cutting-edge research fields including Intelligent Computing and Machine Learning, Signal Processing and Intelligent Control, Image Processing and Computer Vision, Internet of Things and Sensor Technology. This conference aims to boost development of the Computer Area, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on the global scale, improve academic cooperation between China and the outside world, enhance development of Intelligent Computing and Signal Processing industries. It also aims to encourage exchange of information on research frontiers in different fields, connect the most advanced academic resources in China and abroad, turn research results into industrial solutions, bring together talents, technologies and capital to boost development. 


1814097_clock_schedule_time_icon.pngTmportant Dates

Full Paper Submission Date:  2023-02-22

Notification of Acceptance Date:  2023-03-22

Final Paper Submission Date:  2023-04-06


3586357_record_speaker_microphone_speeck_icon.pngKeynote Speakers


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Alberto Del Bimbo 

ACM Distinguished Scientist, Chief Editor of ACM TOMM (ACM Transactions on Multimedia Computing, Communications, and Applications), Chair of ACM SIGMM, IAPR Fellow, IEEE Senior Member, University of Firenze, Italy

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Jianguo Ma 

IEEE Fellow, Zhejiang Lab, China

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Ruqiang Yan 

IEEE Fellow,Xi'an Jiaotong University/School of Mechanical Engineering, China

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Seifedine Kadry 

IET Fellow, IETE Fellow, IACSIT Fellow, Distinguish speaker of IEEE Computer Society, Noroff University College, Norway

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Yonghui Li

IEEE Fellow, University of Sydney, Australia


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Yik-Chung Wu

The University of Hong Kong (HKU), China

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Xiaojun Yuan

niversity of Electronic Science and Technology of China, China





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Submitted papers will be peer reviewed by conference committees. Accepted papers will be included in ICSP 2023 Conference Proceedings.


 Submission System Link 

 Word Template Download 



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 Paper submissions will also be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. Authors are invited to submit papers describing original research work in areas including but not limited to:

  • Algorithms

  • Automated Software Engineering

  • Bioinformatics and Scientific Computing

  • Compilers and Interpreters

  • Computer Animation

  • Computer Architecture and Embedded Systems

  • Computer Games

  • Computer Graphics and Multimedia、

  • Computer Networks

  • ... ...




NEWS UPDATE 

ICSP 2022 Proceedings | IEEE Xplore | ISBN: 978-1-6654-7856-4 | Ei Compendex & Scopus Index 

ICSP 2021 Proceedings | IEEE Xplore | ISBN: 978-0-7381-4369-9 | Ei Compendex & Scopus Index 

ICSP 2020 Proceedings | ISSN: 1742-6588 | Ei Compendex & Scopus Index
ICSP 2019 Proceedings | ISSN: 1742-6588 | Ei Compendex & Scopus Index 
ICSP 2018 Proceedings | ISSN: 2261-236X | Ei Compendex & Scopus Index 
ICSP 2017 Proceedings | ISSN: 1755-1307 | Ei Compendex & Scopus Index 




Sponsored by

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Media Partners

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