You are invited to present 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) which will be held in Xi'an, China, from April 21-23, 2023. The conference is sponsored by Xi'an Shiyou University.
As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future.
To adapt to the changing world and China's fast development in this new era, the 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) will take 'Intelligent Computing and Signal Processing' as its theme." The conference will focus on cutting-edge research fields in Intelligent Computing and Machine Learning, Signal Processing and Intelligent Control, Image Processing and Computer Vision, Internet of Things, and Sensor Technology. The conference aims to boost development in the computer area, expand channels of international academic exchange in science and technology, build a platform for sharing academic resources promote scientific innovation on a global scale, improve academic cooperation between China and the outside world, enhance the development of Intelligent Computing and Signal Processing industries, encourage the exchange of information on research frontiers in different fields, connect the most advanced academic resources in China and abroad, turn research results into industrial solutions, and bring together talents, technologies, and capital to boost development.
Full Paper Submission Date: April 17 2023
ACM Distinguished Scientist, Chair of ACM SIGMM, IAPR Fellow, University of Firenze, Italy
IEEE Fellow，Xi'an Jiaotong University/School of Mechanical Engineering, China
IET Fellow, IETE Fellow, IACSIT Fellow, Distinguish speaker of IEEE Computer Society, Noroff University College, Norway
IEEE Fellow, University of Sydney, Australia
IEEE Fellow, Hohai University, Changzhou, China
University of Electronic Science and Technology of China, China
|Session 1： Digital Signal|
Prof. Shuwen Xu, Xidian University
|Assoc. Prof. Shiling Zhang, State Grid Chongqing Electric Power Company Chongqing Electric Power Research Institute|
|Title: Multi-feature-based detection for small sea surface targets||Title: Establishment of three-dimensional digital twin model of UHV converter transformer equipment based on image data processing and optimization design of its accessory structure|
|Session 2: Computer Communications|
|Prof. Yang Yue, Xi’an Jiaotong University||Prof. Tang Liu, Sichuan Normal University|
|Title: Spatial Orbital Angular Momentum Channels for Optical Communications|
|Session 3: The Internet of Things and Sensor Technology|
Chair/Host: Prof. Fengxiao Tang, Central South University
|Prof. Bomin Mao, Northwestern Polytechnical University||Dr. Qisong Yang, Delft University of Technology|
Title: Optimizing Task Offloading Performance for Electric-driven Intelligent Connected Vehicles: Proposal, Challenges, and Future Directions
|Title: Aversion and Guided Exploration in Safety-Constrained Reinforcement Learning|
|Session 4: Intelligent Computing|
|Prof. Yanhong She, Xi’an Shiyou University||Assistant. Prof. Feng Yin, The Chinese University of Hong Kong, Shenzhen|
|Title: Fuzzy rough set-based feature selection in hierarchical classification||Title: FedLoc: Federated Learning Framework for Data-Driven|
Cooperative Localization and Location Data Processing
Submitted papers will be peer reviewed by conference committees. Accepted papers will be included in ICSP 2023 Conference Proceedings.
All accepted papers, both invited and contributed, the, will be published byIEEE(ISBN: 979-8-3503-0245-5) and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements, and also submitted to EI Compendex and Scopus for indexing. All conference proceedings papers can not be less than 4 pages.
ICSP 2023has been approved by IEEE and being online on IEEE conference search (click)
Paper submissions will also be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. Authors are invited to submit papers describing original research work in areas including but not limited to:
Automated Software Engineering
Bioinformatics and Scientific Computing
Compilers and Interpreters
Computer Architecture and Embedded Systems
Computer Graphics and Multimedia、
ICSP 2022 Proceedings |IEEE Xplore | ISBN: 978-1-6654-7856-4 | Ei Compendex & Scopus Index
ICSP 2021 Proceedings | IEEE Xplore | ISBN: 978-0-7381-4369-9 | Ei Compendex & Scopus Index
ICSP 2020 Proceedings| ISSN: 1742-6588 | Ei Compendex & Scopus Index
ICSP 2019 Proceedings | ISSN: 1742-6588 | Ei Compendex & Scopus Index
ICSP 2018 Proceedings | ISSN: 2261-236X | Ei Compendex & Scopus Index
ICSP 2017 Proceedings |ISSN: 1755-1307 | Ei Compendex & Scopus Index