正文

daily-planning (1).png

Full Paper Submission Date

February 15, 2026

to-do.png

Registration Deadline

February 30, 2026

to-do.png

Final Paper Submission Date

March 10, 2026

to-do.png

Conference Dates

April 16-18, 2026

· About ICSP 2026


You are cordially invited to present at the 11th International Conference on Intelligent Computing and Signal Processing (ICSP 2026), scheduled to take place from April 17 to 19, 2026, in the enchanting city of Xi'an, China. This esteemed conference is proudly sponsored by Xi'an Shiyou University. 

As a global pioneer in scientific innovation, China has been steadfast in fostering an increasingly open environment for scientific exploration. This environment has fostered deeper and broader academic collaborations, giving birth to an innovative community that benefits all. These endeavors have not only contributed significantly to globalization but have also been instrumental in shaping a community with a shared future. We are confident that ICSP 2026 will serve as a platform for exchanging ideas, fostering collaborations, and driving forward the frontiers of intelligent computing and signal processing. We look forward to your participation and contributions at this momentous event.

In response to global technological transformations and China's evolving scientific landscape, the 2026 International Conference on Intelligent Computing and Signal Processing (ICSP 2026) will center on the theme "Frontiers of Intelligent Systems in the Digital Age". Focusing on five pivotal domains—intelligent computing architectures, adaptive signal processing, IoT sensor networks, computer vision, and embedded edge solutions—the conference will drive advancements through open academic platforms and global industry-academia collaborations. Dedicated initiatives such as the Young Scholar Incubation Program and Industry 4.0 Application Labs will address computational challenges in resource-constrained environments, advance ethical governance frameworks for AI, and amplify China's role in shaping global technical standards. By integrating cutting-edge research, cross-border talent networks, and industrial commercialization pathways, ICSP 2026 aims to establish a multidimensional innovation hub that bridges theoretical breakthroughs, sustainable system development, and international scientific synergy.

样式(勿删勿保存)